The LeEco Le X850 had passed TENAA certification from China in November 2016. The phone is rumored to get unveiled on April 11 with Snapdragon 821 chipset.

There has been no official announcement from the China-based company about its launch date. However, according to leaked information coming from well-known tipster, KJuma on Weibo, the LeEco Le X850 is likely to get unveiled in the coming month.

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The same leakster has further revealed that the phone is likely to be available in four color variants of Black, Gold, Gray, and White. It is not known whether the LeEco Le X850 will be unveiled in China or globally on April 11. Since there have been no much details about LeEco's upcoming phone Le X850, it is likely to launch only in its home country.

The LeEco Le X850 is expected to feature a 5.7-inch display with a quad HD resolution of 2560 x 1440 pixels. It is speculated to come powered by Qualcomm Snapdragon 821 chipset. The smartphone is rumored to come in two variants of RAM with 4 GB and 6 GB. It is likely to carry three storages of 32 GB, 64 GB and 128 GB.

It is pegged to sport a 13-megapixel dual camera on its backside and an 8-megapixel front shooter. The device is likely to come equipped with a 3,900 mAh capacity battery, Android Headlines reported.

The LeEco Le X850 phone with a storage of 32 GB is likely to cost at 1,799 ($260). The variant with 64 GB of storage is expected to cost 2,099 ($303), while the 128 GB variant is said to be priced at 2,499 ($361) respectively, PlayfulDroid reported.

LeEco is also rumored to be working on a new flagship smartphone. It is said to come powered by Qualcomm's Snapdragon 835 SoC. The phone is rumored to feature a 6 GB of RAM and a large storage of 256 GB. A leaked render coming from China shows that LeEco's new flagship has a dual-curved screen. The phone also appears slim and it does not feature a 3.5 mm audio jack. It features a USB Type-C port

Here is a review of LeEco Le Pro 3: